Ni bayi, ile-iṣẹ wa le tẹsiwaju lati pese ipele kekere ti 8inchN iru SiC wafers, ti o ba ni awọn iwulo ayẹwo, jọwọ lero ọfẹ lati kan si mi. A ni diẹ ninu awọn wafers ti o ṣetan lati firanṣẹ.
Ni aaye ti awọn ohun elo semikondokito, ile-iṣẹ ti ṣe aṣeyọri pataki kan ninu iwadi ati idagbasoke awọn kirisita SiC titobi nla. Nipa lilo awọn kirisita irugbin ti ara rẹ lẹhin awọn iyipo pupọ ti iwọn ila opin, ile-iṣẹ ti dagba ni ifijišẹ 8-inch N-type SiC kirisita, eyiti o yanju awọn iṣoro ti o nira gẹgẹbi aaye iwọn otutu ti ko ni deede, fifọ gara ati ipin gaasi ipin awọn ohun elo aise ni ilana idagbasoke ti Awọn kirisita SIC 8-inch, ati mu idagba ti awọn kirisita SIC iwọn nla ati adase ati imọ-ẹrọ ṣiṣe iṣakoso. Mu ifigagbaga mojuto ile-iṣẹ pọ si ni ile-iṣẹ sobusitireti kirisita SiC ẹyọkan. Ni akoko kanna, ile-iṣẹ n ṣe agbega ikojọpọ ti imọ-ẹrọ ati ilana ti laini idanwo igbaradi ohun alumọni carbide iwọn nla, mu paṣipaarọ imọ-ẹrọ ati ifowosowopo ile-iṣẹ ṣiṣẹ ni oke ati awọn aaye isalẹ, ati ṣe ifowosowopo pẹlu awọn alabara lati sọ iṣẹ ṣiṣe ọja nigbagbogbo, ati ni apapọ. ṣe igbega iyara ti ohun elo ile-iṣẹ ti awọn ohun elo carbide silikoni.
| 8inch N-type SiC DSP Specs | |||||
| Nọmba | Nkan | Ẹyọ | Ṣiṣejade | Iwadi | Idiwon |
| 1. paramita | |||||
| 1.1 | oniruuru | -- | 4H | 4H | 4H |
| 1.2 | dada iṣalaye | ° | <11-20>4±0.5 | <11-20>4±0.5 | <11-20>4±0.5 |
| 2. Electrical paramita | |||||
| 2.1 | dopant | -- | n-iru Nitrogen | n-iru Nitrogen | n-iru Nitrogen |
| 2.2 | resistivity | ohm · cm | 0.015 ~ 0.025 | 0.01 ~ 0.03 | NA |
| 3. paramita ẹrọ | |||||
| 3.1 | opin | mm | 200± 0.2 | 200± 0.2 | 200± 0.2 |
| 3.2 | sisanra | μm | 500±25 | 500±25 | 500±25 |
| 3.3 | Iṣalaye ogbontarigi | ° | [1-100]±5 | [1-100]±5 | [1-100]±5 |
| 3.4 | Ogbontarigi Ijinle | mm | 1 ~ 1.5 | 1 ~ 1.5 | 1 ~ 1.5 |
| 3.5 | LTV | μm | ≤5(10mm*10mm) | ≤5(10mm*10mm) | ≤10(10mm*10mm) |
| 3.6 | TTV | μm | ≤10 | ≤10 | ≤15 |
| 3.7 | Teriba | μm | -25-25 | -45-45 | -65-65 |
| 3.8 | Ogun | μm | ≤30 | ≤50 | ≤70 |
| 3.9 | AFM | nm | Ra≤0.2 | Ra≤0.2 | Ra≤0.2 |
| 4. Ilana | |||||
| 4.1 | iwuwo micropipe | ea/cm2 | ≤2 | ≤10 | ≤50 |
| 4.2 | irin akoonu | awọn ọta / cm2 | ≤1E11 | ≤1E11 | NA |
| 4.3 | TSD | ea/cm2 | ≤500 | ≤1000 | NA |
| 4.4 | BPD | ea/cm2 | ≤2000 | ≤5000 | NA |
| 4.5 | TED | ea/cm2 | ≤7000 | ≤10000 | NA |
| 5. Didara to dara | |||||
| 5.1 | iwaju | -- | Si | Si | Si |
| 5.2 | dada pari | -- | Si-oju CMP | Si-oju CMP | Si-oju CMP |
| 5.3 | patiku | ea/wafer | ≤100(iwọn≥0.3μm) | NA | NA |
| 5.4 | ibere | ea/wafer | ≤5, Lapapọ Gigun≤200mm | NA | NA |
| 5.5 | Eti awọn eerun / indents / dojuijako / abawọn / koto | -- | Ko si | Ko si | NA |
| 5.6 | Awọn agbegbe Polytype | -- | Ko si | Agbegbe ≤10% | Agbegbe ≤30% |
| 5.7 | iwaju siṣamisi | -- | Ko si | Ko si | Ko si |
| 6. Didara pada | |||||
| 6.1 | pada pari | -- | C-oju MP | C-oju MP | C-oju MP |
| 6.2 | ibere | mm | NA | NA | NA |
| 6.3 | Ẹyin abawọn eti eerun / indents | -- | Ko si | Ko si | NA |
| 6.4 | Pada roughness | nm | Ra≤5 | Ra≤5 | Ra≤5 |
| 6.5 | Pada siṣamisi | -- | Ogbontarigi | Ogbontarigi | Ogbontarigi |
| 7. eti | |||||
| 7.1 | eti | -- | Chamfer | Chamfer | Chamfer |
| 8. Package | |||||
| 8.1 | apoti | -- | Epi-setan pẹlu igbale apoti | Epi-setan pẹlu igbale apoti | Epi-setan pẹlu igbale apoti |
| 8.2 | apoti | -- | Olona-wafer apoti kasẹti | Olona-wafer apoti kasẹti | Olona-wafer apoti kasẹti |
Akoko ifiweranṣẹ: Oṣu Kẹrin Ọjọ 18-2023