6 inch-8 inch LN-on-Si Composite Substrate Sisanra 0.3-50 μm Si/SiC/Sapphire ti Awọn ohun elo

Apejuwe kukuru:

6-inch si 8-inch LN-on-Si composite substrate jẹ ohun elo ti o ga julọ ti o ṣepọ awọn fiimu tinrin litiumu niobate (LN) ẹyọkan pẹlu awọn sobusitireti silikoni (Si), pẹlu awọn sisanra ti o wa lati 0.3 μm si 50 μm. O jẹ apẹrẹ fun semikondokito ilọsiwaju ati iṣelọpọ ẹrọ optoelectronic. Lilo isọpọ to ti ni ilọsiwaju tabi awọn imuposi idagbasoke epitaxial, sobusitireti yii ṣe idaniloju didara kristali giga ti fiimu tinrin LN lakoko ti o nmu iwọn wafer nla (6-inch si 8-inch) ti sobusitireti ohun alumọni lati jẹki ṣiṣe iṣelọpọ ati ṣiṣe idiyele.
Ti a ṣe afiwe si awọn ohun elo LN olopobobo ti aṣa, 6-inch si 8-inch LN-on-Si composite sobusitireti nfunni ni ibaramu gbona ti o ga julọ ati iduroṣinṣin ẹrọ, ti o jẹ ki o dara fun sisẹ ipele wafer-nla. Ni afikun, awọn ohun elo ipilẹ miiran gẹgẹbi SiC tabi oniyebiye le jẹ yan lati pade awọn ibeere ohun elo kan pato, pẹlu awọn ẹrọ RF igbohunsafẹfẹ giga, awọn fọto ti a ṣepọ, ati awọn sensọ MEMS.

Fi imeeli ranṣẹ si wa

Alaye ọja

ọja Tags

Imọ paramita

0.3-50μm LN / LT lori Insulators
Top Layer
Iwọn opin	6-8 inch
Iṣalaye	X, Z, Y-42 ati bẹbẹ lọ.
Awọn ohun elo	LT, LN
Sisanra	0.3-50μm
Sobusitireti (Adani)
Ohun elo	Si, SiC, oniyebiye, Spinel, Quartz

Key Awọn ẹya ara ẹrọ

Sobusitireti akojọpọ 6-inch si 8-inch LN-on-Si jẹ iyatọ nipasẹ awọn ohun-ini ohun elo alailẹgbẹ rẹ ati awọn aye afọwọṣe, ti n mu ohun elo gbooro ni semikondokito ati awọn ile-iṣẹ optoelectronic:

1.Large Wafer Ibamu: Iwọn 6-inch si 8-inch wafer ṣe idaniloju isọpọ ailopin pẹlu awọn laini iṣelọpọ semikondokito ti o wa tẹlẹ (fun apẹẹrẹ, awọn ilana CMOS), idinku awọn idiyele iṣelọpọ ati ṣiṣe iṣelọpọ ibi-pupọ.

2.High Crystalline Didara: Ti o dara julọ epitaxial tabi awọn ilana imudani ṣe idaniloju iwuwo abawọn kekere ni fiimu tinrin LN, ti o jẹ ki o dara julọ fun awọn olutọpa opiti ti o ga-giga, awọn asẹ acoustic igbi (SAW), ati awọn ẹrọ miiran ti o tọ.

3.Adjustable Sisanra (0.3-50 μm): Ultrathin LN Layer (<1 μm) jẹ o dara fun awọn eerun photonic ti a ṣepọ, lakoko ti awọn ipele ti o nipọn (10-50 μm) ṣe atilẹyin awọn ẹrọ RF ti o ga julọ tabi awọn sensọ piezoelectric.

4.Multiple Substrate Aw: Ni afikun si Si, SiC (high thermal conductivity) tabi sapphire (idabobo giga) ni a le yan gẹgẹbi awọn ohun elo ipilẹ lati pade awọn ibeere ti awọn ohun elo giga-igbohunsafẹfẹ, iwọn otutu, tabi awọn ohun elo ti o ga julọ.

5.Thermal ati Mechanical Stability: Awọn ohun alumọni sobusitireti n pese atilẹyin ẹrọ ti o lagbara, ti o dinku warping tabi fifọ lakoko sisẹ ati imudarasi ikore ẹrọ.

Awọn abuda wọnyi wa ipo 6-inch si 8-inch LN-on-Si composite substrate bi ohun elo ti o fẹ fun awọn imọ-ẹrọ gige-eti gẹgẹbi awọn ibaraẹnisọrọ 5G, LiDAR, ati awọn opiti kuatomu.

Awọn ohun elo akọkọ

Sobusitireti akojọpọ 6-inch si 8-inch LN-on-Si jẹ gbigba lọpọlọpọ ni awọn ile-iṣẹ imọ-ẹrọ giga nitori iyasọtọ elekitiro-opiti, piezoelectric, ati awọn ohun-ini akositiki:

1.Optical Communications ati Integrated Photonics: Ṣiṣe awọn olutọpa elekitiro-opitiki ti o ga-giga, awọn itọnisọna igbi, ati awọn iyika iṣọpọ photonic (PICs), ti n ṣalaye awọn ibeere bandwidth ti awọn ile-iṣẹ data ati awọn nẹtiwọki fiber-optic.

Awọn ẹrọ 2.5G/6G RF: Olusọdipúpọ piezoelectric giga ti LN jẹ ki o jẹ apẹrẹ fun igbi acoustic dada (SAW) ati awọn asẹ acoustic igbi (BAW), imudara sisẹ ifihan agbara ni awọn ibudo ipilẹ 5G ati awọn ẹrọ alagbeka.

3.MEMS ati Awọn sensọ: Ipa piezoelectric ti LN-on-Si ṣe iranlọwọ awọn accelerometers ifamọ giga, biosensors, ati awọn transducers ultrasonic fun awọn ohun elo iṣoogun ati ile-iṣẹ.

4.Quantum Technologies: Gẹgẹbi ohun elo opiti ti kii ṣe ojulowo, awọn fiimu tinrin LN ni a lo ni awọn orisun ina kuatomu (fun apẹẹrẹ, awọn orisii photon ti a fi sinu) ati awọn eerun kuatomu ti a fi sinu.

5.Lasers ati Awọn Optics Alailowaya: Awọn ipele Ultrathin LN jẹ ki iran-ibaramu keji ti o dara (SHG) ati awọn ẹrọ oscillation opiti (OPO) fun ṣiṣe laser ati imọran spectroscopic.

Iṣewọn 6-inch si 8-inch LN-on-Si composite sobusitireti ngbanilaaye awọn ẹrọ wọnyi lati ṣe iṣelọpọ ni awọn ile-ọṣọ wafer titobi nla, idinku awọn idiyele iṣelọpọ ni pataki.

Isọdi ati Awọn iṣẹ

A pese atilẹyin imọ-ẹrọ okeerẹ ati awọn iṣẹ isọdi fun 6-inch si 8-inch LN-on-Si composite substrate lati pade R&D oniruuru ati awọn iwulo iṣelọpọ:

1.Custom Fabrication: LN fiimu sisanra (0.3-50 μm), iṣalaye gara (X-cut / Y-cut), ati ohun elo sobusitireti (Si / SiC / sapphire) le ṣe deede lati mu iṣẹ ẹrọ ṣiṣẹ.

2.Wafer-Level Processing: Ipese nla ti 6-inch ati 8-inch wafers, pẹlu awọn iṣẹ-ipari-pada gẹgẹbi dicing, polishing, and covering, aridaju awọn sobsitireti ti ṣetan fun iṣọpọ ẹrọ.

3.Technical Consultation and Testing: Awọn ohun elo ti ohun elo (fun apẹẹrẹ, XRD, AFM), igbeyewo iṣẹ-ṣiṣe elekitiro-opitiki, ati atilẹyin ẹrọ simulation lati mu idaniloju apẹrẹ.

Ise apinfunni wa ni lati ṣe agbekalẹ sobusitireti akojọpọ 6-inch si 8-inch LN-on-Si gẹgẹbi ojutu ohun elo mojuto fun awọn ohun elo optoelectronic ati awọn ohun elo semikondokito, fifun atilẹyin ipari-si-opin lati R&D si iṣelọpọ pupọ.

Ipari

6-inch si 8-inch LN-on-Si composite sobusitireti, pẹlu iwọn wafer nla rẹ, didara ohun elo ti o ga julọ, ati iṣipopada, n ṣe awakọ awọn ilọsiwaju ninu awọn ibaraẹnisọrọ opiti, 5G RF, ati awọn imọ-ẹrọ kuatomu. Boya fun iṣelọpọ iwọn-giga tabi awọn solusan ti a ṣe adani, a fi awọn sobusitireti ti o gbẹkẹle ati awọn iṣẹ ibaramu ṣe agbara lati fun imotuntun imọ-ẹrọ.