Ohun elo Ige Wafer Aifọwọyi Ni kikun Ige Ige Iwọn 8inch/12inch Wafer

Iwọn Ige Wafer Aifọwọyi Ni kikun Awọn ohun elo Ṣiṣẹ Iwon 8inch/12inch Wafer Iwọn Ige Aworan Ifihan

Apejuwe kukuru:

XKH ti ni ominira ni idagbasoke eto gige gige eti wafer ni kikun, ti o nsoju ojutu ilọsiwaju ti a ṣe apẹrẹ fun awọn ilana iṣelọpọ semikondokito iwaju-opin. Ohun elo yii ṣafikun imọ-ẹrọ iṣakoso amuṣiṣẹpọ olona-axis tuntun ati ẹya eto spindle ti o ga-giga (iyara yiyi to pọ julọ: 60,000 RPM), jiṣẹ gige eti pipe pẹlu gige deede to ± 5μm. Eto naa ṣe afihan ibaramu to dara julọ pẹlu ọpọlọpọ awọn sobusitireti semikondokito, pẹlu ṣugbọn kii ṣe opin si:
1.Silicon wafers (Si): Dara fun sisẹ eti ti 8-12 inch wafers;
2.Compound semikondokito: Awọn ohun elo semikondokito iran-kẹta gẹgẹbi GaAs ati SiC;
3.Special sobsitireti: Piezoelectric ohun elo wafers pẹlu LT / LN;

Apẹrẹ apọjuwọn ṣe atilẹyin rirọpo iyara ti awọn ohun elo lọpọlọpọ pẹlu awọn abẹfẹlẹ diamond ati awọn ori gige laser, pẹlu ibamu ju awọn iṣedede ile-iṣẹ lọ. Fun awọn ibeere ilana pataki, a pese awọn solusan okeerẹ pẹlu:
· Ifiṣootọ gige consumables ipese
· Aṣa processing awọn iṣẹ
· Ilana paramita ti o dara ju solusan

Fi imeeli ranṣẹ si wa

Awọn ẹya ara ẹrọ

Imọ paramita

Paramita	Ẹyọ	Sipesifikesonu
O pọju Workpiece Iwon	mm	ø12"
Spindle	Iṣeto ni	Spindle Nikan
	Iyara	3,000-60,000 rpm
	Agbara Ijade	1.8 kW (iyan 2.4) ni 30,000 min⁻¹
	Max Blade Dia.	Ø58 mm
X-Axis	Ige Range	310 mm
Y-Axis	Ige Range	310 mm
	Igbesẹ Ilọsiwaju	0.0001 mm
	Ipo Yiye	≤0.003 mm/310 mm, ≤0.002 mm/5 mm (aṣiṣe ẹyọkan)
Z-Axis	Ipinnu gbigbe	0.00005 mm
Z-Axis	Atunṣe	0.001 mm
θ-Axis	Iyipo ti o pọju	380 iwọn
Spindle Iru		Spindle ẹyọkan, ni ipese pẹlu abẹfẹlẹ lile fun gige oruka
Oruka-Ige Yiye	μm	± 50
Wafer Ipo Yiye	μm	± 50
Nikan-Wafer Ṣiṣe	min / wafer	8
Olona-Wafer Ṣiṣe		Up to 4 wafers ni ilọsiwaju ni nigbakannaa
Ohun elo iwuwo	kg	≈3,200
Awọn iwọn Ohun elo (W×D×H)	mm	2,730 × 1,550 × 2,070

Ilana Ilana

Eto naa ṣaṣeyọri iṣẹ gige gige iyasọtọ nipasẹ awọn imọ-ẹrọ pataki wọnyi:

1.Intelligent Motion Iṣakoso System:
Wakọ mọto laini pipe-giga (tun gbe deede: ± 0.5μm)
· Iṣakoso amuṣiṣẹpọ mẹfa-apa ti n ṣe atilẹyin igbero itọpa eka
· Awọn algoridimu titaniji gbigbọn akoko gidi ti n ṣe idaniloju iduroṣinṣin gige

2.To ti ni ilọsiwaju erin System:
* sensọ giga lesa 3D ti a ṣepọ (ipeye: 0.1μm)
· Ipo wiwo CCD ti o ga (megapiksẹli 5)
· Online didara ayewo module

3.Fully aládàáṣiṣẹ ilana:
· Ikojọpọ/gbigbi aifọwọyi (ibaramu ni wiwo boṣewa FOUP)
· Ni oye ayokuro eto
· Ẹka mimọ-pipade (mimọ: Kilasi 10)

Awọn ohun elo Aṣoju

Ohun elo yii n pese iye pataki kọja awọn ohun elo iṣelọpọ semikondokito:

Aaye Ohun elo	Awọn ohun elo ilana	Awọn anfani Imọ-ẹrọ
IC iṣelọpọ	8/12 "Silicon Wafers	Ṣe ilọsiwaju titete lithography
Awọn ẹrọ agbara	SiC/GaN Wafers	Idilọwọ awọn abawọn eti
Awọn sensọ MEMS	SOI Wafers	Ṣe idaniloju igbẹkẹle ẹrọ
Awọn ẹrọ RF	GaAs Wafers	Ṣe ilọsiwaju iṣẹ-igbohunsafẹfẹ giga
Iṣakojọpọ to ti ni ilọsiwaju	Wafers ti a tunṣe	Ṣe alekun ikore apoti

Awọn ẹya ara ẹrọ

1.Four-ibudo iṣeto ni fun ga processing ṣiṣe;
2.Stable TAIKO oruka debonding ati yiyọ;
3.High ibamu pẹlu bọtini consumables;
4.Multi-axis synchronous trimming technology ṣe idaniloju gige eti pipe;
5.Fully aládàáṣiṣẹ ilana sisan significantly din laala owo;
6.Customized worktable oniru kí idurosinsin processing ti pataki ẹya;

Awọn iṣẹ

1.Ring-drop erin eto;
2.Automatic worktable cleaning;
3.Intelligent UV debonding eto;
4.Operation log gbigbasilẹ;
5.Factory automation module integration;

Ifaramo Iṣẹ

XKH n pese okeerẹ, awọn iṣẹ atilẹyin igbesi aye kikun ti a ṣe apẹrẹ lati mu iṣẹ ohun elo pọ si ati ṣiṣe ṣiṣe ni gbogbo irin-ajo iṣelọpọ rẹ.
1. Awọn iṣẹ isọdi
· Iṣeto ni Awọn ohun elo ti a ṣe deede: Ẹgbẹ imọ-ẹrọ wa ṣe ifọwọsowọpọ ni pẹkipẹki pẹlu awọn alabara lati mu awọn eto eto eto (iyara gige gige, yiyan abẹfẹlẹ, bbl) da lori awọn ohun-ini ohun elo kan pato (Si / SiC / GaAs) ati awọn ibeere ilana.
· Atilẹyin Idagbasoke Ilana: A nfunni ni ṣiṣe ayẹwo pẹlu awọn ijabọ itupalẹ alaye pẹlu wiwọn roughness eti ati aworan aworan abawọn.
· Idagbasoke Iṣọkan Awọn ohun elo: Fun awọn ohun elo aramada (fun apẹẹrẹ, Ga₂O₃), a ṣe alabaṣepọ pẹlu awọn aṣelọpọ ti o jẹ asiwaju lati ṣe agbekalẹ ohun elo-pato awọn abẹfẹlẹ / awọn opiti lesa.

2. Professional Technical Support
· Atilẹyin Oju-aaye ti a ṣe iyasọtọ: Fi awọn onimọ-ẹrọ ti a fọwọsi fun awọn ipele rampu to ṣe pataki (paapaa awọn ọsẹ 2-4), ibora:
Isọdiwọn ohun elo & ilana atunṣe to dara
Ikẹkọ oye oniṣẹ
ISO Kilasi 5 itọsọna isọpọ mimọ
· Itọju Asọtẹlẹ: Awọn sọwedowo ilera idamẹrin pẹlu itupalẹ gbigbọn ati awọn iwadii moto servo lati ṣe idiwọ akoko isunmi ti a ko gbero.
· Abojuto latọna jijin: ipasẹ iṣẹ ṣiṣe ohun elo akoko gidi nipasẹ pẹpẹ IoT wa (JCFront Connect®) pẹlu awọn titaniji anomaly adaṣe.

3. Iye-fikun Services
· Ipilẹ Imọ ilana: Wọle si 300+ awọn ilana gige ti a fọwọsi fun ọpọlọpọ awọn ohun elo (imudojuiwọn ni idamẹrin).
· Iṣatunṣe ọna-ọna ọna ẹrọ: ṣe ẹri idoko-owo ni ọjọ iwaju pẹlu awọn ọna iṣagbega hardware/software (fun apẹẹrẹ, module wiwa abawọn orisun AI).
Idahun Pajawiri: Ti ṣe iṣeduro ayẹwo wiwa latọna jijin wakati 4 ati idasi-wakati 48 lori aaye (agbegbe agbaye).

4. Awọn amayederun iṣẹ
· Ẹri Iṣẹ: Ifaramọ adehun si ≥98% akoko ohun elo pẹlu awọn akoko idahun SLA-ti ṣe atilẹyin.

Ilọsiwaju Ilọsiwaju

A ṣe awọn iwadii itelorun alabara lododun ati ṣe awọn ipilẹṣẹ Kaizen lati jẹki ifijiṣẹ iṣẹ. Ẹgbẹ R&D wa tumọ awọn oye aaye sinu awọn iṣagbega ohun elo – 30% ti awọn ilọsiwaju famuwia wa lati awọn esi alabara.