12inch Ni kikun Aifọwọyi Dicing Dicing Ri Ohun elo Wafer Ifiṣootọ Eto Ige fun Si/SiC & HBM (Al)

Apejuwe kukuru:

Ohun elo dicing pipe ni kikun jẹ eto gige-giga to gaju ni idagbasoke pataki fun semikondokito ati ile-iṣẹ awọn paati itanna. O ṣafikun imọ-ẹrọ iṣakoso išipopada ilọsiwaju ati ipo wiwo ti oye lati ṣaṣeyọri deede sisẹ ipele micron. Ohun elo yii dara fun dicing deede ti ọpọlọpọ awọn ohun elo lile ati brittle, pẹlu:
1.Semiconductor Awọn ohun elo: Silicon (Si), silicon carbide (SiC), gallium arsenide (GaAs), lithium tantalate / lithium niobate (LT / LN) awọn sobsitireti, bbl
2.Packaging Materials: Awọn ohun elo seramiki, awọn fireemu QFN / DFN, awọn ohun elo apoti BGA.
3.Functional Devices: Surface acoustic igbi (SAW) Ajọ, thermoelectric itutu modulu, WLCSP wafers.

XKH pese idanwo ibamu ohun elo ati awọn iṣẹ isọdi ilana lati rii daju pe ohun elo ni ibamu pẹlu awọn iwulo iṣelọpọ awọn alabara, jiṣẹ awọn solusan ti o dara julọ fun awọn ayẹwo R&D mejeeji ati sisẹ ipele.

Fi imeeli ranṣẹ si wa

Awọn ẹya ara ẹrọ

Imọ paramita

Paramita	Sipesifikesonu
Iwọn iṣẹ	Φ8", Φ12"
Spindle	Iwọn-meji 1.2/1.8/2.4/3.0, Max 60000 rpm
Blade Iwon	2" ~ 3"
Y1 / Y2 Atẹgun	Igbesẹ-ẹyọkan: 0.0001 mm
	Ipo deede: <0.002 mm
	Iwọn gige: 310 mm
X igun	Iyara kikọ sii: 0.1-600 mm / s
Z1 / Z2 Atẹgun	Igbesẹ-ẹyọkan: 0.0001 mm
Z1 / Z2 Atẹgun	Ipo deede: ≤ 0.001 mm
θ Axis	Ipeye ipo: ± 15"
Cleaning Station	Iyara Yiyi: 100-3000 rpm
Cleaning Station	Ọna mimọ: Fi omi ṣan laifọwọyi & yiyi-gbẹ
Ṣiṣẹ Foliteji	3-alakoso 380V 50Hz
Awọn iwọn (W×D×H)	1550× 1255×1880 mm
Iwọn	2100 kg

Ilana Ṣiṣẹ

Ohun elo naa ṣaṣeyọri gige pipe-giga nipasẹ awọn imọ-ẹrọ wọnyi:
1.High-Rigidity Spindle System: Yiyi iyara soke si 60,000 RPM, ti o ni ipese pẹlu awọn okuta iyebiye tabi awọn olori gige laser lati ṣe deede si awọn ohun elo ti o yatọ.

2.Multi-Axis Motion Iṣakoso: X / Y / Z-axis ipo išedede ti ± 1μm, so pọ pẹlu awọn iwọn-giga grating irẹjẹ lati rii daju awọn ọna gige-free iyapa.

3.Intelligent Visual Alignment: CCD-giga-giga (5 megapixels) mọ laifọwọyi gige awọn ita ati ki o isanpada fun awọn ohun elo ija tabi aiṣedeede.

4.Cooling & Dust Removal: Iṣakojọpọ eto itutu agbaiye omi mimọ ati yiyọ eruku igbale igbale lati dinku ipa gbigbona ati idoti patiku.

Awọn ọna gige

1.Blade Dicing: Dara fun awọn ohun elo semikondokito ibile bi Si ati GaAs, pẹlu awọn iwọn kerf ti 50-100μm.

2.Stealth Laser Dicing: Ti a lo fun awọn wafers ultra-thin (<100μm) tabi awọn ohun elo ẹlẹgẹ (fun apẹẹrẹ, LT / LN), ṣiṣe iyapa ti ko ni wahala.

Awọn ohun elo Aṣoju

Ohun elo ibaramu	Aaye Ohun elo	Ilana Awọn ibeere
Silikoni (Si)	Awọn ICs, awọn sensọ MEMS	Gige-konge gige, chipping <10μm
Silikoni Carbide (SiC)	Awọn ẹrọ agbara (MOSFET/diodes)	Ige ibajẹ kekere, iṣapeye iṣakoso igbona
Gallium Arsenide (GaAs)	Awọn ẹrọ RF, awọn eerun optoelectronic	Micro-crack idena, cleanliness Iṣakoso
LT/LN Sobsitireti	SAW Ajọ, opitika modulators	Ige ti ko ni wahala, titọju awọn ohun-ini piezoelectric
Awọn sobusitireti seramiki	Awọn modulu agbara, apoti LED	Ṣiṣe ohun elo lile-giga, fifẹ eti
Awọn fireemu QFN/DFN	Ti ni ilọsiwaju apoti	Olona-eerun gige igbakana, ṣiṣe ti o dara ju
WLCSP Wafers	Iṣakojọpọ ipele wafer	Dicing laisi ibajẹ ti awọn wafers tinrin (50μm)

Awọn anfani

1. Fireemu kasẹti iyara ti o ga julọ pẹlu awọn itaniji idena ijamba, gbigbe gbigbe ni kiakia, ati agbara atunṣe-aṣiṣe ti o lagbara.

2. Iṣapeye ipo gige gige meji-spindle, imudara iṣẹ ṣiṣe nipasẹ isunmọ 80% ni akawe si awọn eto alapin-ọkan.

3. Awọn skru bọọlu ti a gbe wọle ti o tọ, awọn itọnisọna laini, ati iwọn Y-axis grating ni pipade-loop iṣakoso, n ṣe idaniloju iduroṣinṣin igba pipẹ ti ẹrọ ti o ga julọ.

4. Ikojọpọ adaṣe adaṣe ni kikun / gbigbe silẹ, ipo gbigbe, gige titete, ati ayewo kerf, dinku iwọn iṣẹ oniṣẹ (OP).

5.Gantry-ara spindle iṣagbesori be, pẹlu kan kere meji-abẹfẹlẹ ayeraye ti 24mm, muu gbooro adaptability fun meji-spindle Ige lakọkọ.

Awọn ẹya ara ẹrọ

1.High-precision ti kii-olubasọrọ iga wiwọn.

2.Multi-wafer meji-abẹfẹlẹ gige lori atẹ kan.

3.Automatic calibration, kerf ayewo, ati awọn eto wiwa fifọ abẹfẹlẹ.

4.Supports Oniruuru ilana pẹlu yiyan laifọwọyi alignment aligoridimu.

5.Fault ara-atunse iṣẹ-ṣiṣe ati ki o gidi-akoko olona-ipo ibojuwo.

6.First-ge ayewo agbara lẹhin-ibẹrẹ dicing.

7.Customizable factory adaṣiṣẹ modulu ati awọn miiran iyan awọn iṣẹ.

Awọn ohun elo ibaramu

Awọn iṣẹ ẹrọ

A pese atilẹyin okeerẹ lati yiyan ohun elo si itọju igba pipẹ:

(1) Idagbasoke adani
Ṣeduro abẹfẹlẹ/awọn ojutu gige lesa ti o da lori awọn ohun-ini ohun elo (fun apẹẹrẹ, lile SiC, brittleness GaAs).

Pese idanwo ayẹwo ọfẹ lati rii daju didara gige (pẹlu chipping, iwọn kerf, aiyẹ oju ilẹ, ati bẹbẹ lọ).

(2) Ikẹkọ Imọ-ẹrọ
· Ikẹkọ Ipilẹ: Ṣiṣẹ ohun elo, atunṣe paramita, itọju igbagbogbo.
· Awọn iṣẹ ilọsiwaju: Imudara ilana fun awọn ohun elo eka (fun apẹẹrẹ, gige laisi wahala ti awọn sobusitireti LT).

(3) Lẹhin-Tita Support
· 24/7 Idahun: Awọn iwadii jijin tabi iranlọwọ lori aaye.
Ipese Awọn apakan apoju: Awọn ọpa ti a ti fipamọ, awọn abẹfẹlẹ, ati awọn paati opiti fun rirọpo ni iyara.
· Itọju Idena: Isọdiwọn deede lati ṣetọju deede ati fa igbesi aye iṣẹ fa.

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Awọn Anfani Wa

✔ Iriri Ile-iṣẹ: Nṣiṣẹ 300+ semikondokito agbaye ati awọn aṣelọpọ ẹrọ itanna.
✔ Imọ-ẹrọ Ige-eti: Awọn itọsọna laini pipe ati awọn eto servo ṣe idaniloju iduroṣinṣin ti ile-iṣẹ.
✔ Nẹtiwọọki Iṣẹ Agbaye: Ibora ni Esia, Yuroopu, ati Ariwa Amẹrika fun atilẹyin agbegbe.
Fun idanwo tabi awọn ibeere, kan si wa!